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Paper Title: Interfacial reaction between liquid tin and solid metals
Authors Name: SATYANARAYAN , Hithesh G Shetty , Ranjan Kishor , Navaneeth P , Kishore
Unique Id: IJRTI1805034
Published In: Volume 3 Issue 5, May-2018
Abstract: Reaction of solid Cu, Al and Stainless steel substrates in liquid tin (Sn) was evaluated. All the substrate specimens were immersed (dipped) in molten Sn for duration of 1min and 3mins at a speed of 2.5mm/s by using a motor and drawn out from the liquid tin at a speed of 2.5 mm/s. The temperature of liquid Sn maintained was 350 C. An interfacial reaction between solid metals in liquid tin and vice versa was investigated. An increase in intermetallic layer with increasing immersion time was observed. The evolution of microstructure and formation of intermetallic compounds at the interface was assessed using metallurgical microscope.
Keywords: Tin, molten, base metal, substrate, alloy, intermetallic
Cite Article: "Interfacial reaction between liquid tin and solid metals", International Journal of Science & Engineering Development Research (www.ijrti.org), ISSN:2455-2631, Vol.3, Issue 5, page no.186 - 189, May-2018, Available :http://www.ijrti.org/papers/IJRTI1805034.pdf
Downloads: 00036
Publication Details: Published Paper ID: IJRTI1805034
Registration ID:180199
Published In: Volume 3 Issue 5, May-2018
DOI (Digital Object Identifier):
ISSN Number: 2456 - 3315
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